The molded substrates L1 and L2 will be very hot when they exit the molding machine and require cooling in such a way as to not create warping or distortion of the substrate. This would be achieved by rotating the substrate at a high speed for the full length of the conveyor, creating a very uniform and linear cooling of the entire substrate. At the same time, the substrates will be positioned in the centre of the work area to be collected by a manipulator and places the substrates on the internal in-line conveyor.

The cooled substrate will advance along independent conveyors where they will be stabilized prior to entering the coating stations. A second manipulation arm will collect alternatively the L1 and L2 substrates and will place them on the dye coating module conveyor.

If for whatever reason the dye-coating module cannot receive substrates, the substrates will be stacked on the individual L1 and L2 dynamic buffer spindles. When no substrates are arriving from the molding, the 'buffered' substrates will be supplied.

There are five dye coater bowls mounted. Each with its own manipulator arm will collect and place a L1 substrate into its associated bowl while collecting a coated substrate and placing on the conveyor. In the bowl, a precise quantity of dye will be dosed and then spun leaving the surface of the substrate practically dry. The L2 substrate will pass directly through.

Each dye-coated substrate will be tested. Passed substrates will be replaced on the feed conveyor. Sub-standard substrates will be stacked on the reject spindle. A manipulating arm will alternatively collect the tested dye-coated L1 and the passed substrate and place them on their individual turnover devices.

Each substrate just prior to entering their ovens will be turned over to counter react the rotation made during the drying cycle.

L1 and L2 substrates have their own dryer unit. Each dryer is in the form of s semicircle. Substrates will enter horizontally and after rotating 180 degrees will exit from the other side. Due to the relatively small size of the dryer units, it is possible to maintain a very tight control over the internal air in providing a uniform temperature throughout the oven adjustable up to 100 degrees C, resulting in a perfectly dried substrate. A manipulator arm will collect the substrates and place them on the metallizer conveyor.

If for whatever reason the downstream module cannot receive substrates, the substrates will be stacked on the individual L1 and L2 dynamic buffer spindles. When substrates are no longer arriving from the dryer, the 'buffered' substrates will be supplied.

Dye-coated substrates will be collected by the metallizer external transfer arm and will be placed inside the metallizer unit. This movement will simultaneously remove the previously processed disc. The metallization (mirror finish) will be applied using masks.
The areas covered by the mask will not be metallized. This masking effect will cause an outer ring of dye to be visible.

The edge cleaning process will be carried out in a bowl by directing a flow of solvent onto the outer edge of the disc while spinning at a high speed.

The coupling of the upper substrate to the lower disc will be carried out in four main steps.
The lower disc will be dosed with an accurate amount of bonding lacquer. The upper substrate will be turned over and lowered at a controlled speed and angle to make the coupling. Once the two parts are together, the disc will be placed in a spin bowl where it will be spun to remove excess lacquer.

The coupled disc will be placed onto a three-position turntable where it will be rotated under the UV lamp and cured. A further rotation will exit the disc where it will be picked up and placed on the final optical inspection device. The UV lamp is designed to create the minimum temperature possible to avoid any physical damage to the disc.

Each disc will be checked for optical defects by a Dr. Schenk inspection system, model VCC.Ism-T + VCC Ism-SL. A selected number of tests will be carried out and the results will determine whether the disc will be placed on the exit or reject spindle.

This process is one of "Copyright Protection" for DVD-R and it is necessary for production of the DVD-R. It writes encryption by laser in the control data zone near the innermost track of the disc, which is called the Lead-in Area.

5 color silk screen printing facility to support any of your OEM order. Offset printing is also available in order to fufill your special requirement

A series of high-resolution off-line testers will used to measure the physical parameters of the optical data storage media including DVD and CD recordable formats. With off-line measurements, trends in production can be observed and optimum settings can be found for the production process assuring process optimization and cost reduction at the same time. Our testers will perform all measurement actions as specified in the official ECMA standards for DVD. This includes the disc clamping during which a force of 2 N from the top and 1/2 N from the bottom is properly applied to the disc. Compliance with specifications is a must to get a clear indication that the disc will play.